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| Place of Origin: | CHINA |
| Certification: | ISO,CE |
| Minimum Order Quantity: | 1 set |
|---|---|
| Price: | Negotiation |
| Packaging Details: | Wooden cases standard export package |
| Delivery Time: | 5-7 working days |
| Payment Terms: | T/T, Western Union, MoneyGram |
| Supply Ability: | 200-500 Sets/Month |
| Name: | Ultraviolet Laser Marking Machine | Laser Type: | UV Laser |
|---|---|---|---|
| Working Accuracy: | 0.02mm | Application: | Laser Marking |
| Beam Diameter: | Less 8mm | Wavelength: | 355nm |
| Weight (KG): | 280 KG | Key Selling Points: | High Safety Level |
| Laser Power: | 3W/5 W/10W | Marking Speed: | 0-7000mm/s |
| Applicable Material: | Special For Plastic, Glass | Marking Area: | 110mm*110mm |
| High Light: | UV laser marking engraving machine,10W UV Laser Marking Machine,7000mm/s UV Laser Marking Machine |
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355nm 3W 5W 10W UV Laser Marking Engraving Machine
Low Power DPSS UV Lasers (3W/5W) is featured with compact structure with extremely convenient installation and debugging. They have adopted the built-in laser diode technology to avoid the effect of fiber shaking on output laser. Besides, the beam quality is excellent enough to ensure the stability and reliability for mass production, which can meet the special manufacturing and processing demand in harsh industrial working condition.
No | Parameter | Unit |
1 | Model | SL-UV 3W/5W10W |
2 | Laser wavelength | 355nm |
3 | Average power | > 3W@40kHz |
4 | Pulse Repetition Rate | 20kHz-200kHz |
5 | Spatial Mode | TEM00 (M2 1.2) |
6 | Pulse Width | 15ns@ 40kHz |
7 | Working Materials | Nd:YVO4 |
8 | Beam-pointing Stability | 25μrad |
9 | Beam Roundness | 90% |
10 | Beam diameter | less 8mm |
11 | Beam Divergence | less 2mrad |
12 | Pulse to pulse stability | less 3%rms |
13 | Ambient temperature | 18-35 degree |
14 | Cooling | Water cooling |
15 | Power consumption | 500W |
16 | Classification | Class4 |
UV laser marking machine widely used in 3C industry marking, as well as industrial micro machining, including marking for a diversity of materials, plastic,glass, LED scribing, laser rapid prototyping, removal of metal and non-metal coating, silicon wafer processing and so on.
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